The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

Above: Elon Musk provides some unique insight into the engineering process in order to "implement rigorously" (Source: Everyday Astronaut) Elon has discussed a variety of engineering topics in great ...

New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes ...