The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

Researchers at Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU) have developed a simple yet accurate method for finding defects in the latest generation of silicon carbide transistors. This ...

Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these ...

To further shrink electronic devices and to lower energy consumption, the semiconductor industry is interested in using 2D materials, but manufacturers need a quick and accurate method for detecting ...

Scientists have demonstrated hyperthermal ion implantation (HyTII) as an effective means of substitutionally doping graphene, resulting in a low-defect film with a tunable bandstructure amenable to a ...