SAN JOSE, Calif. — IC package design has become a huge bottleneck for getting chips out the door, but there are few automated tools that can help, according to panelists at the International Symposium ...

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services “We are pleased to collaborate with Cadence, a leader in electronic design software, ...

Santa Clara, Calif. — As chip designers, Kaushik Sheth and Egino Sarto struggled to fit silicon into cost-effective packages. Now they're trying to convince other chip designers to adopt a ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

MEYREUIL, France & SAN JOSE, Calif.--(BUSINESS WIRE)--Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

A recently developed software tool automatically checks for design-rule violations as locations are designated for wire bonds between die and package lead frames. Known as the Post-Layout Bond Tool, ...

ROME, June 20, 2023 /PRNewswire/ -- An internationally respected System/ASIC company is adopting MZ Technologies' GENIO™ 1.7 fully-integrated EDA co-design tool. The company adopted a full-suite ...