Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...

UK researchers have proposed the use of photovoltaic-thermal energy for desalination purposes, via an approach based on synergistic electro-thermal coupling mechanisms. They have found that some ...

Researchers at Shanghai University have developed a physics-constrained, data-efficient artificial intelligence framework ...

Multi-die designs, 2.5D and 3D, have been rising in popularity as they offer tremendously increased levels of integration, a smaller footprint, performance gains and more. While they are attractive ...

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