MUNICH, Germany--(BUSINESS WIRE)--SUSS MicroTec (FWB:SMH) (GER:SMH) announced that it has shipped and successfully installed a 300mm production lithography tool order at Amkor Technology, Inc.

WILLOW GROVE, Pa.–Kulicke & Soffa Industries Inc. today announced that National Semiconductor Corp. has become the latest chip maker to license wafer-bumping technology for advanced IC packaging.

PHOENIX — While conventional wire bond-based chip assembly operations struggle with the current industry slowdown, flip-chip and associated wafer-bumping demand appears to be taking off. In fact, many ...

PLAINVIEW, N.Y., Feb. 12, 2019 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer ...

Interconnect, a wafer bumping service company, announced qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications, producing bonds that are stable at high ...

Silicon Precision Industries (SPIL) and Xilinx jointly announced the successful development of 12-inch wafer solder bumping for flip-chip packaging. With Xilinx as technology partner, SPIL began to ...

Taiwan-based Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd (SPIL) have dived into 12-inch wafer bumping volume production, but Orient Semiconductor Electronics (OSE ...

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...